FOR THERMAL COUPLING AND HEAT DISSIPATION

HEAT SINK COMPOUND is a highly thermally conductive silicone grease.  This, together with a low moisture and metallic impurity content, make it suitable for a wide variety of applications within the electrical components industry. 

APPLICATIONS
Used within a semi-conductor devise case it affords excellent shock protection for the transistor or diode elements and provides protection against inadvertent contamination of these elements before the devices are finally encapsulated.  Also acts as an excellent moisture buffer.

Heat Sink Compound also finds use a contact material when mounting semi-conductor devices on heat-sinks, obviating air gaps between imperfectly mating surfaces.  In this application, it may be used in conjunction with electrically insulating mica washers without increasing the electrical leakage in any way.  Indeed, in many cases insulation may be improved.

TECHNICAL DATA

Appearance	:	White, thixotropic paste
Odour	:	Almost odourless
SG	:	2.3
Evaporation	:	7 days at room temperature, 0.02%
		24 hours at 150°C, 0.2%
Dielectric strength	:	10 kv/mm
Permittivity, 1 MHz	:	4.3
Power factor, 1 Mhz	:	3.3 x 10-3
Volume resistivity	:	At room temperature, 1.1 x 1015 ohm.cm
Thermal conductivity	:	At 40°C, 16.7 x 10-4 cals/cm.sec, °C
Temperature range	:	Operational from -50°C to + 200°C
Solubility	:	Insoluble in water, soluble in some solvents
Flammability	:	Not classified as flammable
Packaging	:	25gm tube.